Article Utilized Simple Visual Idt Problem
Find another scholarly article related to the IDT problem and research question you identified in the last assignment. Complete a review (aka “annotation”) of the scholarly source you found, organized as follows:
1. Give the source reference in APA citation style
2. In your own words, state the following, in essay form:
a) SUMMARIZE: What is the author’s/researcher’s purpose for conducting this research/inquiry?
b) What research methods were used? Are they experimental, quantitative, qualitative, mixed?
c) If applicable, describe the subjects of the research and what happened. Were the subjects participants/interviewees, systems, observed events, review of other studies, or something else? Were they subjected to experimental treatment or were they observed, surveyed or trained and tested, etc.?
d) What were the findings and conclusions? What evidence and results are presented?
e) ANALYZE: What is remarkable about this study? What questions do you have about this study?
f) SYNTHESIZE: How does this article contribute to your understanding of your topic and HOW DOES IS IT HELP TO ANSWER YOUR MAIN QUESTION? Indicate clearly WHY this source is useful for your inquiry.
h) QUOTES: Are there one or two specific quotations that are useful or which are central to answering your main research question? Quote it (them) and remember to enclose them in quotes and note the page number. Also, remember to cite page numbers for any information that you have summarized or paraphrased.
can you talk it from
ntegrated Device Technology (IDT) Problem
The primary purpose of the research was to identify various defects associated with the
Integrated Circuit (IC) using problem
solving tools. The study further suggests that the primary
concern of the IC packaging industry is defects since they can
occur at any stage of production. It
is worthwhile noting that Integrated Device Technology (IDT) is a company under the
semiconductor and IC industry. Therefore, a feasible solution will result after identifying the root
of the defects. The article utili
zed simple visual tools like stratification and Ishikawa diagram.
Also, the journal employs a Pareto analysis, which is a statistical tool. Ultimately, the authors
carried out experiments using the Taguchi design. These tools indicate that the researchers
both quantitative and qualitative approaches to analyze the results. It is essential to understand
that the results showed the highest number of defects in 6SC70M, 6SOT23M, and 5SC70M IC
areto analysis indicated that molding was the
chief cause of the errors in AC.
For instance, it contributes 62.96 and 57.14 percent of 6SOT23M and 5SC70M respectively.
The notable aspect of the entire research is how authors strive to increase the reliability of
their results. For instance,
after the identification of the defective packages, still, the author
employs stratification to confirm the results. Furthermore, the research narrow down to the
actual cause of the defects in the AC. Ultimately, the use of graphs and tables enable the
udience to understand the relationship between the variables; therefore, it will be easy to
conclude. However, Apart from the tools, what are other techniques or methods that can be used
to identify AC defects?
It is significant to understand that my topic was about challenges that semiconductors
companies encountered during manufacturing. Therefore, it was essential to focus on IDT since
it is an example of Semiconductor Company. The article was beneficial becau
se it provides a
coherent analysis of various problems that are common in all corporations dealing with products
such as attenuators, switches, and IC. Furthermore,
have not only under
stood the challenges
but also tools used to identify them.
It is worth to note that the central question was about the challenges facing
semiconductors companies. A
uthors, address this question when they stated that, “Using the
Pareto analysis, it was also observed that molding is the process that contribut
es most to the
defects of the three types of packages which cover 62.96% of 6SOT23M, 57.14% of 5SC70M
and 73.91% of 6SC70M
(Abidin, K. A. Z., Lee, K. C., Ibrahim, I., & Zainudin, A, 2011, p.
.” Thus, I was able to i
dentify the exact problem that is rampant in semiconductors